Copper Clad Laminate (Copper Film)
Copper Foil: Mainly divided into electrolytic copper and rolled copper. Common thicknesses include 1oz, 1/2oz, and 1/3oz.
Substrate Film: Common thicknesses are 1mil and 1/2mil.
Adhesive (Bonding Agent): Thickness determined according to customer requirements.
Cover Film (Protective Film)
Cover Film: Used for surface insulation. Common thicknesses are 1mil and 1/2mil.
Adhesive (Bonding Agent): Thickness determined according to customer requirements.
Release Paper: Prevents the adhesive from picking up foreign matter before lamination; facilitates handling.
PI Stiffener Film
Stiffener: Reinforces the mechanical strength of FPC and facilitates surface mounting. Common thicknesses range from 3mil to 9mil.
Adhesive (Bonding Agent): Thickness determined according to customer requirements.
Release Paper: Prevents the adhesive from picking up foreign matter before lamination.
EMI: Electromagnetic film, protects the circuits inside the board from external interference (strong electromagnetic areas or interference-prone areas).