AiT Flexible Epoxy ME7156 Low-Stress Reworkable Epoxy Adhesive

Product Description:

ME7156 is a reworkable, alumina-filled, electrically insulating, and thermally conductive epoxy adhesive. It offers excellent flexibility and is capable of bonding materials with highly mismatched CTEs (e.g., alumina-aluminum, silicon-copper). Due to its high thermal conductivity, it is suitable for bonding large-area chips and components.

ME7156 can be easily reworked at temperatures between 80-100°C. It is recommended to use volumetric dispensing equipment with a ceramic dispensing tip.

Packaging: ME7156 is available in syringes for automated dispensing or in jars. Both viscosity and thixotropy can be customized according to your specific requirements.                                                                    

Usage Steps:

(1)  Before opening the dispensing jar or syringe, allow it to reach room temperature until thawed.

(2)  Dispense onto a clean substrate.

(3)  Pre-bake at 60°C for 30 to 60 minutes to achieve optimal bonding results. Pre-baking is not required for all applications**

(4)  Cure according to the recommended curing conditions.

AiT Flexible Epoxy ME7156 Low-Stress Reworkable Epoxy Adhesive