Chip Packaging Conductive Adhesive 84-1LMI
Price:￥面議
Contact Info
- Add:松江區(qū)松樂(lè)路128號(hào), Zip:
- Contact: 陳工
- Tel:13817204081
- Email:hy_ccs168@163.com
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Description
Additional Information
Chip Packaging Conductive Adhesive 84-1LMI
Product Description
LOCTITE ABLESTIK 84-1LMI offers the following product characteristics:
Technology: Epoxy
Appearance: Silver
Curing: Thermal Cure
Product Advantages:
High Electrical Conductivity
Low Bleed
Low Outgassing
Application: Die Attach
pH Value: 5.5
Filler Type: Silver
LOCTITE ABLESTIK 84-1LMI die attach adhesive is used for microelectronic die bonding
Chip Packaging Conductive Adhesive 84-1LMI
| Industry Category | |
|---|---|
| Product Category | |
| Brand: | ABLESTIK |
| Spec: | 84-1LMI |
| Stock: | 1000 |
| Manufacturer: | |
| Origin: | China / Shanghai / Songjiangqu |
