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China Guangzhou Ceramic Capillary, Ceramic Nozzle for LED Encapsulation, Shenzhen Ceramic Capillary - China Supplier
China Guangzhou Ceramic Capillary, Ceramic Nozzle for LED Encapsulation, Shenzhen Ceramic Capillary - China Supplier China Guangzhou Ceramic Capillary, Ceramic Nozzle for LED Encapsulation, Shenzhen Ceramic Capillary - China Supplier China Guangzhou Ceramic Capillary, Ceramic Nozzle for LED Encapsulation, Shenzhen Ceramic Capillary - China Supplier

Guangzhou Ceramic Capillary, Ceramic Nozzle for LED Encapsulation, Shenzhen Ceramic Capillary

Price:¥29
Industry Category: Media/Books/Other Books
Product Category:
Brand: 蘇森源
Spec: 定做


Contact Info
  • Add:東莞寮步鎮(zhèn)富竹山工業(yè)區(qū)d, Zip: 523000
  • Contact: 李星
  • Tel:15015379097
  • Email:49602247@qq.com

Other Products

Description
Additional Information



Our company's ceramic capillary sample production process: Customers provide two physical samples or relevant key dimensions, and the company designs according to requirements for planned production.
Our company offers a complete range of ceramic capillary models, fully capable of replacing imported ceramic capillaries. Stable quality. Welcome to inquire and cooperate. We maintain ready stock, support custom special shapes, and ensure timely delivery.

Our company is located in Dongguan, Guangdong and Suzhou, Jiangsu, specializing in the production of ceramic capillaries, which can be used for chip packaging of various aperture sizes. Fully replaces imported products. High cost-effectiveness. Welcome to inquire.
Ceramic capillaries (ceramic nozzles) are widely used in semiconductor IC packaging and LED packaging, serving as key core tools in the packaging process. Ceramic capillaries are used as bonding wire tools in the wire bonding process, applicable for the bonding and packaging of circuits such as thyristors, surface acoustic wave devices, LEDs, diodes, transistors, and IC chips. The main products provide electrical connections between chips and external systems, offer a stable and reliable working environment for chips, provide mechanical and environmental protection for integrated circuit chips, and ensure thermal pathways for normal heat dissipation. In semiconductor processes, packaging is one of the most critical steps, with "wire bonding" being the primary method for achieving circuit connections between chips and substrates. An indispensable tool in this process is the ceramic capillary. Welcome to inquire and support cooperation.



Industry Category Media/Books/Other Books
Product Category
Brand: 蘇森源
Spec: 定做
Stock: 1250000
Manufacturer:
Origin: China / Guangdong / Dongshi
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