Wire bonding uses fine metal wires (copper, gold, etc.) along with heat, pressure, and ultrasonic energy to achieve a tight bond between the metal leads and the substrate pads, enabling electrical interconnection between the chip and the substrate, as well as information exchange between chips.

New ceramic capillaries (ceramic nozzles) are now available, and we are sincerely seeking agents nationwide. We are recruiting distributors for the following regions:
Shenzhen, Guangzhou, Wuhan, Zhengzhou, Shenyang, Beijing, Shanghai, Wuxi, Nanjing, Changzhou, Ningbo, Hangzhou, Tianshui, Xi'an, Jinan, Nanchang, Hefei. Those interested in ceramic capillaries are welcome to contact us.