Our company is located in Dongguan, Guangdong and Suzhou, Jiangsu, specializing in the independent production of ceramic capillaries, which can be used for IC chip packaging of various aperture sizes. Fully replaces imported products. Welcome to inquire.

The company is primarily engaged in the research and development of semiconductor bonding tools, namely ceramic capillaries (ceramic nozzles). Ceramic capillaries are widely used in semiconductor IC packaging and LED packaging, serving as critical core tools in the packaging process. The main products provide electrical connections between chips and external systems, offer a stable and reliable working environment for chips, provide mechanical and environmental protection for integrated circuit chips, and ensure thermal pathways for proper heat dissipation. Our products target the high-end market, highlighting comprehensive advantages in materials, processes, and machining technology. We focus on the high-precision ceramic industry and are committed to becoming a leader in the domestic semiconductor bonding tool industry.
In semiconductor processes, packaging is one of the most critical steps, with "wire bonding" being the primary method used to achieve circuit connections between chips and substrates. In this process, one indispensable tool is the ceramic capillary (ceramic nozzle).
Ceramic capillaries (Ceramic bonding tools), also known as ceramic nozzles, are axisymmetric ceramic tools with vertical holes, belonging to precision microstructural ceramic components. In application, ceramic capillaries (ceramic nozzles) are used as bonding tools in the wire bonding process and can be applied to the bonding and packaging of circuits such as thyristors, surface acoustic wave devices, LEDs, diodes, transistors, and IC chips.