Indium8.9HF is a no-clean solder paste capable of air reflow, specifically designed to meet the requirements of higher process temperature alloy systems commonly used in the electronics industry, such as SnAgCu and SnAg, while also being suitable for other alloy systems that can replace traditional lead-containing solders. Indium8.9HF offers excellent stencil transfer efficiency and can be used under various process conditions. It features high probe testability, minimizing ICT failures. It is one of Indium Corporation's solder paste products with the lowest voiding rate.

Features
? Halogen-free as per EN14582 test
? Low voiding rate for BGA, CSP, and QFN
? One of Indium Corporation's most stable solder pastes
? High transfer efficiency for fine apertures (<=0.66 AR)
? Eliminates hot/cold slump
? Highly oxidation-resistant
? Excellent wetting on oxidized BGAs and pads
? Superior soldering performance under high temperatures and extended reflow
? Transparent, probe-testable flux residue
? Compatible with SnPb alloys