Gaokaitai was established in 2011 and has been focusing on the Internet of Things (IoT) / Mobile Internet of Things (MIoT) for over a decade, providing customers with truly comprehensive support and customized solutions.
Gaokaitai adheres to the corporate values of "Customer First, Teamwork, Positivity, Embracing Change, Honesty and Trustworthiness, Gratitude and Dedication, Results-Oriented," upholds the spirit of "Constantly Striving for Self-Improvement and Cultivating Virtue to Carry the World," and insists on the development path of "Creating Value for Customers," achieving mutual benefits and win-win outcomes with partners.
Gaokaitai offers cost-effective products: industrial/military communication modules, positioning modules, self-organizing network chips, quantum public network cluster intercom solutions, MCU/IC chips, digital isolators, communication RF antennas, and more. We can provide customers with reliable, convenient, secure, and intelligent IoT communication solutions at www.szgktkj.1688.com, and we can also offer optimal solutions based on your specific requirements.
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Product Description:

The SIM8260C-M2 is a multi-band 5G wireless/LTE-FDD/LTE-TDD/HSPA+ module that supports R16 5G passive security assurance/confidentiality agreements.

It features powerful expansion capabilities with a rich set of interfaces, including PCIe, USB 3.1, GPIO, and more. This module provides great flexibility and ease of integration for customer applications.

The SIM8260C-M2 adopts the M.2 form factor and is command-compatible with the SIM8200X series modules. This minimizes customer costs and shortens time to market.

It is designed for data communication applications that require high throughput under various wireless propagation conditions. Due to its unique attributes of efficiency, security, and flexibility, the module is well-suited for many applications.

Product Advantages:

M.2 form factor with rich interfaces

High-throughput data transmission

The SIM8260C-M2's commands are compatible with the SIM8200X series modules

Form Factor: M.2
Dimensions (mm): 52.0*30.0*2.3
Supported Bands: 5G-NR: n1, n3, n5*, n7*, n8*, n20*, n28, n38*, n40*, n41, n48*, n77*, n78, n79
LTE-FDD: B1, B3, B5, B7, B8, B20, B28
LTE-TDD: B34, B38, B39, B40, B41, B42* WCDMA B1, B3*, B5, B8
Positioning: L1/L5*
Operating Temperature: -30℃ ~ +70℃

Electrical Properties

Operating Voltage (V): 3.135 ~ 4.4

Data Transmission

Sub-6G SA: 2.1Gbps (DL)/900Mbps (UL)
Sub-6G NSA: 2.8Gbps (DL)/600Mbps (UL)
LTE: 1Gbps (DL)/150Mbps (UL)
HSPA+: 42Mbps (DL)/5.76Mbps (UL)

Software Properties

Supported Protocols: TCP/IP/IPV4/IPV6/Multi-PDP/FTP/FTPS/HTTP/HTTPS/MQTTS/DNS/SSL3.0
TLS: ●
File System: ●
FOTA: ●
Android RIL: Android 6/7/8/9
USB Driver: Microsoft Windows Win7/Win8/Win10/Linux/Android
MBIM: Win8/Win10
NDIS: Linux/Win7/Win8/Win10
Firmware Upgrade: USB

Interfaces

SIM Card: 1.8V/2.95V
USB: ●
PCM: ●
I2C: ●
Receive Diversity: ●

Receive Diversity: ●