Devices and parts vulnerable to ESD damage

Devices and parts vulnerable to ESD damage:

Devices and parts vulnerable to ESD damage:

1. Structure: small chip size, small heat capacity, small signal device, high-frequency device, micro-metallization, shallow EB junction, thin gate, oxide layer, etc.

Structure: small chip size, small heat capacity, small signal device, high-frequency device, micro-metallization, shallow EB junction, thin gate, oxide layer, etc.

2. Parts: the high resistance part of the input circuit and the output circuit, the edge of the metallized zone and other areas.

Parts: the high resistance part of the input circuit and the output circuit, the edge of the metallized zone and other areas.

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